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mpc85xx: HiveAP-330: add tmp125 temperature sensor

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the Aerohive HiveAP-330 and HiveAP-350 come equipped
with an TI TMP125 temperature chip. This patch wires
up the necessary support for this sensor and exposes
it through hwmon / thermal sensor framework. Upstream
support is coming, but it has to go through hwmon-next
first.

Signed-off-by: Christian Lamparter <chunkeey@gmail.com>
This commit is contained in:
Christian Lamparter 2022-02-17 21:15:54 +01:00
parent 71d86a2db9
commit 8144f9c665
3 changed files with 81 additions and 1 deletions
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71
target/linux/generic/backport-5.10/870-hwmon-next-hwmon-lm70-Add-ti-tmp125-support.patch Normal file
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@ -0,0 +1,71 @@
From 31d8f414e1596ba54a4315418e4c0086fda9e428 Mon Sep 17 00:00:00 2001
From: Christian Lamparter <chunkeey@gmail.com>
Date: Fri, 18 Feb 2022 10:06:43 +0100
Subject: hwmon: (lm70) Add ti,tmp125 support
The TMP125 is a 2 degree Celsius accurate Digital
Temperature Sensor with a SPI interface.
The temperature register is a 16-bit, read-only register.
The MSB (Bit 15) is a leading zero and never set. Bits 14
to 5 are the 1+9 temperature data bits in a two's
complement format. Bits 4 to 0 are useless copies of
Bit 5 value and therefore ignored.
Signed-off-by: Christian Lamparter <chunkeey@gmail.com>
Link: https://lore.kernel.org/r/43b19cbd4e7f51e9509e561b02b5d8d0e7079fac.1645175187.git.chunkeey@gmail.com
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
---
--- a/drivers/hwmon/lm70.c
+++ b/drivers/hwmon/lm70.c
@@ -34,6 +34,7 @@
#define LM70_CHIP_LM71 2 /* NS LM71 */
#define LM70_CHIP_LM74 3 /* NS LM74 */
#define LM70_CHIP_TMP122 4 /* TI TMP122/TMP124 */
+#define LM70_CHIP_TMP125 5 /* TI TMP125 */
struct lm70 {
struct spi_device *spi;
@@ -87,6 +88,12 @@ static ssize_t temp1_input_show(struct d
* LM71:
* 14 bits of 2's complement data, discard LSB 2 bits,
* resolution 0.0312 degrees celsius.
+ *
+ * TMP125:
+ * MSB/D15 is a leading zero. D14 is the sign-bit. This is
+ * followed by 9 temperature bits (D13..D5) in 2's complement
+ * data format with a resolution of 0.25 degrees celsius per unit.
+ * LSB 5 bits (D4..D0) share the same value as D5 and get discarded.
*/
switch (p_lm70->chip) {
case LM70_CHIP_LM70:
@@ -102,6 +109,10 @@ static ssize_t temp1_input_show(struct d
case LM70_CHIP_LM71:
val = ((int)raw / 4) * 3125 / 100;
break;
+
+ case LM70_CHIP_TMP125:
+ val = (sign_extend32(raw, 14) / 32) * 250;
+ break;
}
status = sprintf(buf, "%d\n", val); /* millidegrees Celsius */
@@ -136,6 +147,10 @@ static const struct of_device_id lm70_of
.data = (void *) LM70_CHIP_TMP122,
},
{
+ .compatible = "ti,tmp125",
+ .data = (void *) LM70_CHIP_TMP125,
+ },
+ {
.compatible = "ti,lm71",
.data = (void *) LM70_CHIP_LM71,
},
@@ -184,6 +199,7 @@ static const struct spi_device_id lm70_i
{ "lm70", LM70_CHIP_LM70 },
{ "tmp121", LM70_CHIP_TMP121 },
{ "tmp122", LM70_CHIP_TMP122 },
+ { "tmp125", LM70_CHIP_TMP125 },
{ "lm71", LM70_CHIP_LM71 },
{ "lm74", LM70_CHIP_LM74 },
{ },

9
target/linux/mpc85xx/files/arch/powerpc/boot/dts/hiveap-330.dts
View File

@ -24,6 +24,7 @@
led-running = &led_power_green;
led-upgrade = &led_fault_red;
label-mac-device = &enet0;
spi0 = &spi0;
};
memory {
@ -113,6 +114,14 @@
board_soc: soc: soc@ffe00000 {
ranges = <0x0 0x0 0xffe00000 0x100000>;
spi0: spi@7000 {
temperature-sensor@1 {
compatible = "ti,tmp125";
reg = <1>;
spi-max-frequency = <5000000>;
};
};
i2c@3100 {
tpm@29 {
compatible = "atmel,at97sc3204t";

2
target/linux/mpc85xx/image/p1020.mk
View File

@ -15,7 +15,7 @@ define Device/aerohive_hiveap-330
DEVICE_MODEL := HiveAP-330
DEVICE_ALT0_VENDOR := Aerohive
DEVICE_ALT0_MODEL := HiveAP-350
DEVICE_PACKAGES := kmod-tpm-i2c-atmel
DEVICE_PACKAGES := kmod-tpm-i2c-atmel kmod-hwmon-lm70
BLOCKSIZE := 128k
KERNEL := kernel-bin | uImage none
KERNEL_INITRAMFS := kernel-bin | MultiImage none